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Brand Name : KEGU
Place of Origin : China
Price : 200-500 yuan/kg
Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability : 2,000 pcs/month
Packaging Details : Strong wooden box for Global shipping
Model Number : Customizable
Material : SiC
Composition:SiC : >85%
Color : Black
Density : ≥3.65g/cm3
Max. Service Temp : 1380℃
Flexural Strength : 250MPa
Hardness : ≥84HRA
Water Absorption : ≤0.2%
Abrasion : < 0.02%
Bending strength : ≥290MPa
Sphercial Alumina Powder Fot High Thermal Conductive Material
This product is a spherical alumina powder with high globularity with high thermal conductivity, developed by high temperature melting technologies and indicates excellent characteristics for rubber and plastic filler and ceramic base material.
Specifications:
| Type | D50(um) | S.S.A.(m2/g) |
| SA-05 | 5±1 | 0.60 |
| SA-10 | 10±2 | 0.50 |
| SA-20 | 20±3 | 0.40 |
| SA-30 | 30±3 | 0.30 |
| SA-40 | 40±5 | 0.20 |
| SA-70 | 70+/-6 | 0.12 |
Physical Property:
| Appearance | White powder |
| Specific Gravity (g/cm3) | 3.60 |
| Melting point (℃) | 2050 |
| Moisture (%) | ≤ 0.05 |
| EC(uS/cm) | ≤ 10 |
| PH | 7.0±0.5 |
| α-Al2O3 Cotent(%) | ≥ 90 |
| Spherical particles ratio(%) | ≥ 95 |
Chemical Property:
| Type | Chemical Composition | ||||||
| Al2O3% ≥ | SiO2% ≤ | Fe2O3% ≤ | Na2O%≤ | K2O% ≤ | MgO%≤ | CaO% ≤ | |
| SA-05 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
| SA-10 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
| SA-20 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
| SA-30 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
| SA-40 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
| SA-70 | 99.0 | 0.05 | .05 | 0.02 | 0.01 | 0.01 | 0.01 |
Character:
2. High thermal conductivity: High filling density enables production of compounds with higher thermal conductivity and higher heat dissipation rate compared to crystalline silica.
3. Low abrasivity: Due to its Spherical shape, less-wearing of kneading machines, forming machines and dies.
Applications:
1. Filler for heat sink sheet, filler for heat dissipation board (MC board), heat dissipating
grease, phase change sheet
2. Filler for semiconductor sealing resin
3. Silicone-based heat dissipating adhesive, filler for compound
4. Ceramic filler
Quality control:


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White D50 Sphercial Alumina Powder 3.60g/Cm3 Specific Gravity Images |